The coating films of the piezoelectric/electrostrictive device 141 can be formed by, for example, implementing the film forming method such as sputtering, CVD or laser ablation (implementing twice because of both surfaces) like the piezoelectric/electrostrictive device 100. [0097] In a piezoelectric/electrostrictive device 150 shown in FIG. 5, all the surfaces (end surfaces and side surfaces) of t