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  • Thus the peeling on the interface can be prevented. [0083] In case of using an organic resin as the first encapsulater, a resin such as epoxy resin having a glass transition temperature of 150??? C. or more is preferably used. [0084] Next explained is a second semiconductor light emitting device according to the invention. [0085]FIGS. 4a and 4B are cross-sectional views schematically showing const
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