The conductive layer 51 is then patterned photolithographically to produce the patterned wiring structure 51 shown in FIG. 5B. A passivating covering 57 (e.g., CrCu) is then deposited to prevent oxidation of the wiring 51, as shown in FIG. 5C. [0031] As shown in FIG. 5D, ink lines 54 are formed of conductive particles, such as particles of silver and carbon which are dispersed in an organic matrix