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  • The substrate may be a polyimide or other material that can withstand relatively large lateral mechanical displacement....http://www.google.fr/patents/US5045921?utm_source=gb-gplus-shareBrevet US5045921 - Pad array carrier IC device using flexible tape Recherche avanc???e dans les brevets Num???ro de publicationUS5045921 AType de publicationOctroi Num???ro de demandeUS 07/457,002 Date de publicati
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