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  • The depth of the interconnection use grooves M is for example about 800 nm, while the width is for example about 250 nm to 100 ??m. [0204] Next, as shown in FIG. 1C, a barrier metal film 103 is formed on the surface of the interlayer insulation film 102 and in the contact holes CH and the interconnection grooves M. This barrier metal film 103 is formed by a material such as Ta, Ti, W, Co, TaN, TiN
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