The n-electrode 40a of the laser diode 40 and the extraction electrode 411 are electrically connected to a connection pad of a wiring member 203 of a head gimbal assembly (HGA) 17 (see FIG. 5) using a method such as wire bonding or solder ball bonding (SBB) or the like, and thereby is configured such that power is supplied to the laser diode 40.