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  • 97Jul 28, 1998Lsi Logic CorporationMethod of mounting a flip-chipUS5786232 *Jan 2, 1997Jul 28, 1998Micron Display Technology, Inc.Multi-layer electrical interconnection methods and field emission display fabrication methodsUS5838061 *Nov 18, 1996Nov 17, 1998Lg Semicon Co., Ltd.Semiconductor package including a semiconductor chip adhesively bonded theretoUS5910705 *Sep 16, 1997Jun 8, 1999Micron Tec
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