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  • 7 Feb 2009Tokyo Electron LimitedDeposition method for forming a film including metal, nitrogen and carbonUS749490815 May 200724 Feb 2009Applied Materials, Inc.Apparatus for integration of barrier layer and seed layerUS750134324 Apr 200710 Mar 2009Applied Materials, Inc.Formation of boride barrier layers using chemisorption techniquesUS750134424 Apr 200710 Mar 2009Applied Materials, Inc.Formation o
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