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  • Next, as shown in FIG. 2E, an interconnection layer 105 made of Al, W, WN, Cu, Au, or Ag, or an alloy film of these metals, is formed on the barrier film 103 to a thickness of for example about 1600 nm so as to bury the contact holes CH and the interconnection grooves M. The interconnection layer 105 is preferably formed by electroplating or electroless plating, but it is also possible to form the
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