About: isa:356647475   Sponge Permalink

An Entity of Type : prov:Entity, within Data Space : webisa.webdatacommons.org associated with source dataset(s)

AttributesValues
rdf:type
prov:value
  • Before the application of the metal layer into the perforations of the semiconductor wafer, an insulation layer may be applied to the walls of the perforations in order to increase the reliability of the electronic component, especially since, in the case of highly doped semiconductor chips, said semiconductor chips themselves become conductive.
prov:wasQuotedFrom
is prov:wasDerivedFrom of
Alternative Linked Data Views: ODE     Raw Data in: CXML | CSV | RDF ( N-Triples N3/Turtle JSON XML ) | OData ( Atom JSON ) | Microdata ( JSON HTML) | JSON-LD    About   
This material is Open Knowledge   W3C Semantic Web Technology [RDF Data] Valid XHTML + RDFa
OpenLink Virtuoso version 07.20.3217, on Linux (x86_64-pc-linux-gnu), Standard Edition
Data on this page belongs to its respective rights holders.
Virtuoso Faceted Browser Copyright © 2009-2012 OpenLink Software