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  • Materials, such as Ta, TaN, Ti, TiN, and Al, etc., in contact with these films may react with the fluorine and/or fluorine bearing species therebycompromising the interfacial adhesion between the films and materials.Thus, a fluorine diffusion barrier is needed for the integration of fluorinated low-k materials.U.S. Pat. No. 5,817,572 to Chiang et al. describes a method for forming interconnections
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