| prov:value
| - In one embodiment, top dielectric layer 230 or intermediate dielectric layers 330 and 430 contains a dielectric material, such as silicon, silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, hafnium oxide, aluminum silicate, hafnium silicate, hafnium silicon oxynitride, zirconium oxide, zirconium silicate, derivatives thereof, or combinations thereof.
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