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  • In terms of adhesion and thermal shock resistance, an epoxy resin represented by the following formula (1) is preferable. ##STR1## where R denotes H or CH3 and each of R2,R3,R5,R6,R2',R3',R5' and R6' denotes H, Cl, Br or an organic group. such as methyl, ethyl, isopropyl, buthyl or phenyl; and n is an integer, such as 0 to 5.
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