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An Entity of Type : prov:Entity, within Data Space : webisa.webdatacommons.org associated with source dataset(s)

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  • In a semiconductor package comprising a plurality of leads which each have a bottom surface including at least a portion which is completely exposed in an encapsulation material, and a semiconductor chip which defines multiple sides, is covered by the encapsulation material and electrically connected to at least one of the leads, the improvement comprising:
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