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An Entity of Type : prov:Entity, within Data Space : webisa.webdatacommons.org associated with source dataset(s)

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  • The present invention relates to assembly of a semiconductor package, and more particularly, to a tape having implantable conductive lands which is substituted for a rigid substrate during processes for manufacturing a semiconductor package such as a ball grid array (BGA) type package, and a method for manufacturing the same.
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