| http://www.w3.org/ns/prov#value | - The vacuum annealing of FIG. 8D is performed using the same or similar method described previously with reference to FIG. 1C. Through vacuum annealing, impurities, such as carbon, which remain on the HfO2 dielectric layer 134, can be effectively removed, and the HfO2 dielectric layer 134 can become effectively densified. [0055] Referring to FIG. 8E, the vac
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