About: http://webisa.webdatacommons.org/101303234

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The solder bumps 60 can comprise any known solder material, such as Sn, Pb, Ag, Cu, Sb, Au, and can be formed using any known bumping process, including a dispensing or screen printing process.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com