About: http://webisa.webdatacommons.org/10165585

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Moreover, it is apparent that the polishing method of the present invention is applicable for an SOI wafer, crystal thin film and the like, other than a semiconductor wafer described in the embodiment.
http://www.w3.org/ns/prov#wasQuotedFrom	google.es