About: http://webisa.webdatacommons.org/101664158

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Formed together with various bonding pads and lines on an insulation substrate 52 of a material such as polyimide, is a plurality of bump lands 53 for mounting thereon solder bumps.
http://www.w3.org/ns/prov#wasQuotedFrom	google.es