| http://www.w3.org/ns/prov#value | - As shown in FIG. 8A and FIG. 9A, the first step is a step for forming the element substrate 11, in which the plural heaters 20 and predetermined wirings for applying voltage to the heaters 20 are provided on a main surface of a silicon chip, for example, by patterning treatment and an insulation film 21 for enhancing the dispersing of accumulated heat is provided to cover the heaters 20 and a prot
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