PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • In the embodiment illustrated in FIGS. 2 a???2 g, this chip is a semiconductor die that has bump terminations 212, which are also called IC contacts below.
http://www.w3.org/ns/prov#wasQuotedFrom
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