| http://www.w3.org/ns/prov#value | - As shown in FIGS. 1 and 2, the multi-layered wiring structure of the first embodiment comprises a substrate 21 that is made of an insulator such as glass and which has the following components superposed in the order written: lower signal lines 31 formed of chromium (Cr); a first insulation layer 33a made of silicone nitride (SiNx); shield liens 37 that are formed of chromium (Cr) on top of the fi
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