| http://www.w3.org/ns/prov#value | - ved that exposing the substrate to hydrogen may reduce any metal oxides, such as copper oxide, that may have formed on the floor 118 of the feature 114 during previous substrate processing steps. [0072] After the substrate 100 is pre-cleaned and optionally exposed to a hydrogen plasma or a thermal hydrogen treatment, a barrier layer 130 is deposited on the substrate 100, as shown in FIG. 2B and de
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