About: http://webisa.webdatacommons.org/104530278

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Each IC chip 203 and the base substrate 202 are connected by, for example, a wire bonding with such as an Al wire 204, flip chip bonding, or the like.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com