| http://www.w3.org/ns/prov#value | - Each bump electrode surface treating layer 18 is a barrier layer that is inserted for improving solder reflow resistance when direct joining between the external electrode 19 made of such as tin and the bump electrode 14 made of mainly copper tends to cause metal counter diffusion, and further, this metal diffusion portion has a property of becoming weak, and is made of a material such as nickel.
|
