| http://www.w3.org/ns/prov#value | - Additives for cyanide copper plating, include compounds having active sulfur groups and/or containing metalloids such as selenium or tellurium; organic amines or their reaction products with active sulfur containing compounds; inorganic compounds containing such metals as selenium, tellurium, lead, thallium, antimony, arsenic; and organic nitrogen and sulfur heterocyclic compounds.
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