| http://www.w3.org/ns/prov#value | - osed at bottoms of the patterned grooves; forming a plating seed layer on the second insulating layer including inner surfaces of the patterned grooves and then forming a resist pattern on the plating seed layer except for portions of the pattern grooves; filling the pattern grooves with a conductor by an electrolytic plating using the plating seed layer as a power supply layer; and removing the r
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