| http://www.w3.org/ns/prov#value | - Powder coatings according to the present invention and films formed therefrom may be used as binders for sealing resins in sealing semiconductors, and may be used to seal or insulative the surfaces of semiconductors, photo-semiconductors, IC's (integrated circuits), LSI's, transistors, thyristors, diodes, materials for electric laminates, capacitors, e.g. ceramic capacitors, resistors, printed cir
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