| http://www.w3.org/ns/prov#value | - For this purpose, the insulating particles are plated or deposited with a metal such as gold Au, copper Cu or nickel Ni, and the metallic layer on the insulating particles can contact to the copper particles so that an increase in contact probability due to the aggregation of the copper particles and also in their own surface conductivity results in a further decrease of the entire connection resi
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