| http://www.w3.org/ns/prov#value | - However, a single wafer tray may be used for loading and unloading the semiconductor wafer. [0576] As described above, according to the present invention, it is possible to shorten the time required to transfer a workpiece to be polished, such as a semiconductor wafer, to the top ring, for thereby greatly increasing the number of processed workpieces per unit time, i.e., throughput. [0577] Further
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