| http://www.w3.org/ns/prov#value | - Conductive interconnection studs may be formed of conductive materials including but not limited to metals, metal alloys and highly doped polysilicon deposited through methods including but not limited to thermally assisted evaporation methods, electron beam assisted evaporation methods, Chemical Vapor Deposition (CVD) methods and Physical Vapor Deposition (PVD) sputtering methods, as appropriate
|
