| http://www.w3.org/ns/prov#value | - ocated bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devicesUS20040207061May 7, 2004Oct 21, 2004Farrar Paul A.Multi-chip electronic package and cooling systemUS20040256686Apr 8, 2004Dec 23, 2004Stmicroelectronics S.R.L.Method for manufacturing a micro-electro-mechanical device, in particular an optical mic
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