| http://www.w3.org/ns/prov#value | - To perform these steps, after photolithographically applying resist in a suitable pattern to the outer polyimide layer 16, a metal such as a mixture of tungsten with a small amount of titanium, W(Ti), is sputtered over the entire surface including the resist and vias, and the resist (and portions of the sputtered metal) is then lifted to leave a pattern of thin, sputtered traces forming the patter
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