| http://www.w3.org/ns/prov#value | - For example, the resin composition for printed wiring board of the present invention is as such, or in a form of a varnish in which they are dissolved or dispersed in a solvent, impregnated into a substrate such as a glass cloth, etc., and then, drying in a drying oven usually at a temperature of 80 to 200??? C. (provided that, when a solvent is used, it is set at a temperature capable of volatili
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