| http://www.w3.org/ns/prov#value | - However, many problems arise by wire bonding the optoelectronic submodule to the interconnect board, such as being extremely labor intensive, costly, inaccurate, as well as providing additional problems with encapsulation, such as wire sweep, reliability, and the like, Moreover, if for any reason one of the wire bonds is unsuitable or unreliable, product can be manufactured that is both unreliable
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