| http://www.w3.org/ns/prov#value | - or securement to the wafer carrier, and a lower end surrounding the wafer, with the lower end having a portion of the inner surface contacting the wafer peripheral edge so as to confine wafer movement during a polishing operation; the retainer body inner surface extending from the upper end to the lower end and including a first portion spanning at least a portion of the thickness of the wafer car
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