| http://www.w3.org/ns/prov#value | - For damascene integrated circuit and memory applications (where wiring is relatively close to the copper-sensitive silicon substrate), the conductive layers are typically deposited on a dielectric layer and typically comprise metals such as tantalum (Ta), tungsten (W), titanium (Ti), aluminum (Al), copper (Cu), and alloys thereof, and semiconductors, such as doped silicon (Si), doped polysilicon,
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