| http://www.w3.org/ns/prov#value | - For one embodiment, the special contact pads may be fabricated from one or more metal layers including aluminum, copper, gold, or other metals or conductive materials. [0110] Special contact pads 310 may not be permanently bonded out to an integrated circuit package (e.g., typical plastic and ceramic chip packages); rather, the pads may be used for receiving test input information (e.g., address,
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