| http://www.w3.org/ns/prov#value | - Co., Ltd.Package structure for a semiconductor device incorporating enhanced solder bump structureUS7543377 *Oct 29, 2007Jun 9, 2009Intel CorporationPerimeter matrix ball grid array circuit package with a populated centerUS7851922Sep 9, 2008Dec 14, 2010Round Rock Research, LlcBond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the r
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