| http://www.w3.org/ns/prov#value | - To meet these demands, die manufacturers often stack multiple dies on top of each other to increase the capacity or performance of the device within the limited surface area on the circuit board or other element to which the dies are mounted.BRIEF DESCRIPTION OF THE DRAWINGSFIG. 1A is a partially schematic illustration of a representative microelectronic workpiece carrying microelectronic dies con
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