| http://www.w3.org/ns/prov#value | - only at the locations where there is a pattern.Since there is no passivation film region 12a shown in FIG. 8, when dicing is carried out along the slit 25 of the scribe line having the above-described structure, the load on the dicing blade (not shown) is reduced accordingly, so that thegeneration of cracks 24 on the passivation film 12 of the edges of chips 3 is prevented and the useful life of
|
