| http://www.w3.org/ns/prov#value | - More specifically, in a fabrication process that yields a base layer (e.g., substrate, one or more diffusions, and poly gates), followed by alternating dielectric and metal layers, the continuity stack includes a base layer continuity element, B, disposed in contact with a continuity element formed in a first dielectric layer, D1 (e.g., a via filled with metal or other conductive material), follow
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