| http://www.w3.org/ns/prov#value | - Copper metal deposition can then be continued on the oxygen-bonded copper surface and the resulting copper metal film has good adhesion on the underlying diffusion barrier surface. [0035] Although in the examples described above, copper is mentioned as the metal of choice, the method according to the invention is also applicable to depositing other metals, such as aluminum, Ni, Co and Ru, onto bar
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