| http://www.w3.org/ns/prov#value | - However, if the materials forming the first conductive layers 5015a to 5019 a and the second conductive layers 5015 b to 5019 b are weak against heat, it is preferred to conduct the heat treatment after the first interlayer insulating film 5036 (an insulating film mainly containing silicon, for example, a silicon nitride film) is formed as in this embodiment to protect the wires and the like. [010
|
