| http://www.w3.org/ns/prov#value | - For example, there are a method where a metal oxide film is formed between a substrate with high heat resistance and an integrated circuit, and the metal oxide film is weakened by crystallization to peel off the integrated circuit; a method where a peeling layer is destroyed by laser irradiation to peel off an integrated circuit from a substrate; and a method where a substrate on which an integrat
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