| http://www.w3.org/ns/prov#value | - However, there is a problem when the heat sinks 16 are attached to the memory module 10 in the above-mentioned manner, in that the operation is extremely troublesome, for bringing the heat sinks 16 into close contact with the circuit board 12 of the memory module 10 via a tape 28 while positioning the through-holes 24 to the attachment holes 22 corresponding thereto and inserting the rivets 26 one
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