| http://www.w3.org/ns/prov#value | - or layer, to cause the inner via hole filled with the conductive material to form an inner-via-hole conductive member with a thickness substantially equal to a thickness of the core part; and [0024] etching the metal foils so as to leave the protruded portion as the land portion. [0025] A second circuit board producing method of the present invention is a method for producing a circuit board inclu
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