| http://www.w3.org/ns/prov#value | - However, the above package for a discrete device cannot satisfy this requirement, and other suitable member are not currently found. [0005] As for a device such as a diode, transistor and capacitor, which are discrete devices, the back surface of the discrete device 4 is metallized and die-bonded to the lead frame 1 a by an Au???Si eutectic bonding at a high temperature of 430??? C. However, when
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