| http://www.w3.org/ns/prov#value | - However, for the sake of simplicity, discussions will concentrate mainly on exemplary use of wafer bonding in a three-dimensional (3-D) wafer-to-wafer vertical stack, although the scope of the present invention is not limited thereto. [0017] Attention now is directed to the drawings and particularly to FIGS. 1A-1B, an example three-dimensional (3-D) wafer-to-wafer vertical stack according to an em
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