| http://www.w3.org/ns/prov#value | - No particular restriction is put on the sputtering process which is used to form the layer mainly comprising the oxides of silicon, and examples of the effectively usable sputtering process include a DC sputtering process, a DC magnetron sputtering process, an RF sputtering process, an RF magnetron sputtering process, an ion beam sputtering process and an electronic cyclotron resonance (ECR) sputt
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